EDB4064B4PB-1D-F

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Orderable parts

EDB4064B4PB-1D-F-D
EDB4064B4PB-1D-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    4Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x64
  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    4Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x64

Data Sheets

1Gbit, 2Gbit, 4Gbit U98M Embedded LPDDR2 SDRAM Data Sheet

EDB1316BD (1Gb/2KB - single die, x16), EDB1332BD (1Gb/2KB - single die, x32), EDB2432B4 (2Gb/2KB - dual die, x32), EDB4064B4 (4Gb/2KB - quad die, x64)
  • File Type: PDF
  • Updated: 2016-11-17
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Simulation Models

HSPICE: U98M Mobile LPDDR2 SDRAM

HSPICE for U98M AT, IT, UT, WT
  • File Type: ZIP
  • Updated: 2016-06-20
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IBIS: U98M Mobile LPDDR2 SDRAM

Rev 1.1; Temp ranges supported= AT, IT, UT, WT, XT
  • File Type: ZIP
  • Updated: 2016-06-12
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Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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TN-46-22: T69M (50nm) to T79M (4xnm) Transition Guide

Transition guide for migration from T69M to T79M
  • File Type: PDF
  • Updated: 2016-06-24
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13
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CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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